From cleanroom envelope to process tool hook-up — we engineer semiconductor fabrication facilities. ISO Class 1-8 cleanrooms, 18.2 MOhm-cm ultrapure water, chemical and gas delivery, exhaust abatement, and real-time facility monitoring.
ISO Class 1-8 cleanrooms with laminar flow, fan filter units (FFU), air showers, pass-throughs, gowning areas, and ESD-safe flooring.
Process tool connections: gas, chemical, UPW, exhaust, electrical, and data. Valve manifold boxes (VMB) and interface units (VMB/IU) for all tools.
UPW generation: pretreatment, reverse osmosis, ion exchange, membrane degas, and final polishing to 18.2 MOhm-cm resistivity with TOC < 1 ppb.
Chemical & Gas Delivery
Exhaust & Abatement
Real-time cleanroom monitoring: particle count, temperature, humidity, pressure differential, utility status, and alarm management with SCADA integration.
| Specification | Value | Notes |
|---|---|---|
| Cleanroom Class | ISO Class 1-8 | Laminar / turbulent flow |
| UPW Resistivity | 18.2 MOhm-cm | TOC < 1 ppb, particles < 0.05um |
| UPW Capacity | Up to 200 m3/hr | Multi-stage RO + DI |
| Chemical Delivery | Acid, base, solvent | Bulk + point-of-use |
| Gas Systems | Process, inert, toxic | Gas cabinets + VMB |
| Abatement | Scrubber + thermal | PFC, SiH4, acid gas |
| Build Timeline | 24-52 weeks | From design to qualification |
| Standards | SEMI S2, F57, E10 | Semiconductor industry |
On-site sampling, flow measurement, and characterization of existing infrastructure and discharge requirements.
Treatment train selection, equipment sizing, 3D layout, and hydraulic modeling with redundancy analysis.
Mechanical, electrical, and controls installation by in-house teams with FAT/SAT protocols.
Performance validation, optimization, operator training, and complete documentation package.
Reach out with your facility requirements, production targets, and timeline. Our engineering team will respond with a preliminary scope within 3 business days.
Contact Engineering Team