MCLANTIS PCB manufacturing factory engineering

SECTOR MC-PCB · PCB FACTORY ENGINEERING

PCB Factory Engineering

From inner-layer imaging to high-density drilling, electroplating, solder mask, and final finish — we engineer PCB manufacturing facilities that deliver consistent yield and registration accuracy.

50/50μm

MIN TRACE WIDTH

2-64 Layers

LAYER COUNT

16-36 wks

BUILD TIMELINE

ENGINEERING SCOPE

What we engineer in the PCB factory

Inner-Layer Imaging

Dry film lamination, UV exposure (LDI/DWR), development, and etching lines for inner-layer pattern transfer with registration accuracy down to ±0.025mm.

Drilling Engineering

Mechanical and laser drill arrays, spindle cooling, chip extraction, drill bit management, and automated panel loading for via and through-hole formation.

Electroplating Lines

Copper electroplating (vertical continuous / panel), tin plating, DES lines, rectifier systems, and anode management with uniform thickness distribution.

Solder Mask & Surface Finish

Solder mask coating (LPI spray/curtain), UV exposure, HASL, ENIG, OSP, and immersion tin/silver finish lines with controlled atmosphere curing.

Routing & Electrical Test

CNC routing and V-scoring, flying probe and fixture-based electrical test, AOI inspection, and automated panel sorting with yield tracking.

Wet Process & Chemical Delivery

Acid/alkaline etching, desmear, electroless copper, micro-etch, and bulk chemical distribution with leak detection and secondary containment.

TECHNICAL SPECIFICATIONS

Engineering standards

Specification	Value	Notes
Min Trace Width / Spacing	50/50 μm (2/2 mil)	LDI + controlled etching
Layer Count	2-64 layers	Rigid, flex, rigid-flex, HDI
Drill Accuracy	±0.05mm	Mechanical + laser (UV/CO2)
Plating Uniformity	±10% across panel	Cu vertical continuous plating
Surface Finish	HASL / ENIG / OSP / Imm Ag	Multiple finish lines
Panel Size	Up to 610×560mm	Standard 18×21" / 20×24"
Build Timeline	16-36 weeks	From design to qualification
Standards	IPC-A-600, IPC-6012, ISO 9001	PCB industry standards

EXECUTION METHODOLOGY

Four-phase delivery

Capacity & Process Audit

On-site assessment of current yield, bottleneck identification, layer mix analysis, and utility capacity review for the target production volume.

Line Design & Layout

Process flow optimization, equipment selection, 3D factory layout, chemical/exhaust routing, and automation integration planning.

Installation & Integration

Mechanical installation, chemical/gas hook-up, electrical and controls integration, MES connectivity, and factory acceptance testing (FAT).

Commissioning & Handover

Process qualification, first-article validation, yield optimization, operator training, and complete documentation with maintenance protocols.

FREQUENTLY ASKED QUESTIONS

What types of PCB factories can MCLANTIS engineer?

MCLANTIS engineers facilities for rigid PCBs (2-64 layers), flex and rigid-flex boards, HDI and any-layer designs, metal-core PCBs, and high-frequency materials (Rogers, PTFE).

What minimum trace width and spacing can be achieved?

With LDI (Laser Direct Imaging) and controlled etching, trace width and spacing down to 50/50 μm (2/2 mil) can be achieved in volume production. Advanced HDI lines support 25/25 μm with laser-drilled microvias.

How is plating bath safety and consistency managed?

All plating lines include automated chemical dosing, real-time bath analysis (Cu, acid, chloride), rectifier control, fume extraction, and emergency dump systems. Bath life and additive consumption are tracked by MES.

How long does a typical PCB factory project take?

A full PCB manufacturing facility ranges from 16 to 36 weeks depending on capacity and layer complexity. Single-process line retrofits (e.g., adding LDI or ENIG) can be completed in 6-10 weeks.